Changed VBus_SW and GND pins to solid copper#3
Open
PhBrb wants to merge 2 commits intoCentyLab:mainfrom
Open
Conversation
Owner
|
Hi @PhBrb, We have experiment with a previous version using solid pour. It does make soldering very difficult. But I think just solid pour on top layer is good with enough thermal break. |
Author
|
I reduced the solid copper pins to the pins in the top right and added high power markings on the silkscreen. Nevertheless, if you have tested both the solderability and high power capability, then I have no objections. Personal opinion: having to use a larger solder tip for power pins is fine. |
This file contains hidden or bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
Sign up for free
to join this conversation on GitHub.
Already have an account?
Sign in to comment
2 participants
Add this suggestion to a batch that can be applied as a single commit.This suggestion is invalid because no changes were made to the code.Suggestions cannot be applied while the pull request is closed.Suggestions cannot be applied while viewing a subset of changes.Only one suggestion per line can be applied in a batch.Add this suggestion to a batch that can be applied as a single commit.Applying suggestions on deleted lines is not supported.You must change the existing code in this line in order to create a valid suggestion.Outdated suggestions cannot be applied.This suggestion has been applied or marked resolved.Suggestions cannot be applied from pending reviews.Suggestions cannot be applied on multi-line comments.Suggestions cannot be applied while the pull request is queued to merge.Suggestion cannot be applied right now. Please check back later.
The thermal reliefs on VBus_SW and GND are quite small for 5 A.
I changed them to solid copper.
The copper pour has to be updated, I did not do this to keep the diff readable.