According to USB specifications the data lines should be routed as 90ohm impendance differential and 45ohm single ended.
On the indoor layout the lines are very poorly matched to 140 / 126ohm.
Staying within spec on 2 layer boards is practically impossible as it requires 3+mm traces.
The current layout has very high risk of having communication issues and/or running the drivers within hub/ethernet chipsets out of spec.
The board should be changed to a 4 layer construction where the top to second (GND) layer thickness can be selected for the proper impedance matching.
Additionally the board would benefit from proper ground plane stitching and good practice power supply design (it's really bad).
Check section 7 of the USB 2.0 spec.
https://www.pjrc.com/teensy/beta/usb20.pdf
According to USB specifications the data lines should be routed as 90ohm impendance differential and 45ohm single ended.
On the indoor layout the lines are very poorly matched to 140 / 126ohm.
Staying within spec on 2 layer boards is practically impossible as it requires 3+mm traces.
The current layout has very high risk of having communication issues and/or running the drivers within hub/ethernet chipsets out of spec.
The board should be changed to a 4 layer construction where the top to second (GND) layer thickness can be selected for the proper impedance matching.
Additionally the board would benefit from proper ground plane stitching and good practice power supply design (it's really bad).
Check section 7 of the USB 2.0 spec.
https://www.pjrc.com/teensy/beta/usb20.pdf